Description: Features 1、FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes. 2、PRECISE POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature. 3、COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use. 4、VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs. 5、STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life. Specification Item Type: BGA Reballing Stencil Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in Product Material: Stainless Steel Package List 1 x BGA Reballing Stencil
Price: 10.95 USD
Location: US
End Time: 2024-11-08T10:02:29.000Z
Shipping Cost: 0 USD
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Item Specifics
All returns accepted: ReturnsNotAccepted
Brand: Unbranded
MPN: Does not apply
